Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1999-01-22
2000-11-07
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
451289, B24B 100
Patent
active
061431230
ABSTRACT:
An apparatus and method for uniformly planarizing a surface of a semiconductor wafer and accurately stopping CMP processing at a desired endpoint. In one embodiment, a planarizing machine has a platen mounted to a support structure, an underpad attached to the platen, a polishing pad attached to the underpad, and a wafer carrier assembly. The wafer carrier assembly has a chuck with a mounting cavity in which the wafer may be mounted, and the wafer carrier assembly moves the chuck to engage a front face of the wafer with the planarizing surface of the polishing pad. The chuck and/or the platen moves with respect to the other to impart relative motion between the wafer and the polishing pad. The planarizing machine also includes a pressure sensor positioned to measure the pressure at an area of the wafer as the platen and the chuck move with respect to each other and while the wafer engages the planarizing surface of the polishing pad. The pressure sensor generates a signal in response to the measured pressure that corresponds to a planarizing parameter of the wafer. In a preferred embodiment, the planarizing machine further includes a converter operatively connected to the pressure sensor, a controller operatively connected to the converter, and a plurality of drivers operatively connected to the controller and positioned in the mounting cavity.
REFERENCES:
patent: 5762536 (1998-06-01), Pant et al.
Robinson Karl M.
Yu Chris Chang
Lorin Francis J.
Micro)n Technology, Inc.
LandOfFree
Chemical-mechanical planarization machine and method for uniform does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical-mechanical planarization machine and method for uniform, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical planarization machine and method for uniform will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1637033