Chemical-mechanical planarization controller

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S123000

Reexamination Certificate

active

07437206

ABSTRACT:
The invention provides a model-based control approach to chemical-mechanical planarization (CMP) control. The preferred embodiment comprises mathematical models of the CMP process. These models play a critical role in obtaining superior control performance. Model-based Control Design involves the construction of a dynamic mathematical model of the system to be controlled, e.g. a removal rate model of a CMP system. The model can then be evaluated via computer simulations, and validated using data from the system. The invention provides a method and apparatus that processes in-situ data from a suite of real-time sensors and produces real-time commands to multiple actuators, such as applied pressures, slurry-flow rate, and wafer/pad velocity. A key aspect of the invention is an integrated model-based pressure-temperature-velocity-slurry flow control system that includes many innovations in real-time mode identification, real-time gain estimation, and real-time control.

REFERENCES:
patent: 6137570 (2000-10-01), Chuang et al.
patent: 6273972 (2001-08-01), Andler
patent: 6292265 (2001-09-01), Finarov et al.
patent: 6347977 (2002-02-01), Frost
patent: 6476921 (2002-11-01), Saka et al.
patent: 6719615 (2004-04-01), Molnar
patent: 6741903 (2004-05-01), Bode et al.
patent: 6798529 (2004-09-01), Saka et al.
patent: 6884147 (2005-04-01), Toprac
patent: 2002/0137448 (2002-09-01), Suh et al.
patent: 2004/0198180 (2004-10-01), Toprac
SC solution, Inc., Modeling and model-based control for CMP, Jan. 1, 1999, National Science Foundation, SC report No. CMP—001, pp. 1-22.
G. F. Franklin, J. D. Powell, A. Emami-Naeini, Feedback Control of Dynamic Systems, 5th Ed., Prentice-Hall, 2006.
G. F. Franklin, J. D. Powell, Michael Workman, Digital Control of Dynamic Systems, 3rd Ed., Addison-Wesley, 1998.
A. Emami-Naeini, J. L. Ebert, R. L. Kosut, D. de Roover, and S. Ghosal, “Model-based Control for Semiconductor and Advanced Materials Processing: An Overview,” in Proc. American Control Conference, Jun. 2004.
J. Moyne, E. del Castillo and A. M. Hurwitz, Run-to-Run Control in Semiconductor Manufacturing, CRC Press, 2001.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemical-mechanical planarization controller does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical-mechanical planarization controller, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical planarization controller will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3989661

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.