Chemical mechanical planarization compositions for reducing...

Details Chemical mechanical planarization compositions for reducing... Chemical mechanical planarization compositions for reducing...

2007-11-27

2007-11-27

Norton, Nadine (Department: 1765)

Compositions

Etching or brightening compositions

C257SE21204

Reexamination Certificate

active

10634964

ABSTRACT:
An aqueous chemical mechanical planarizing composition includes an oxidizer for promoting barrier removal and an abrasive. Inhibitor decreases removals of a metal interconnect. The composition has a carboxylic acid polymer having at least one repeat unit of the polymer comprising at least two carboxylic acid functionalities, a pH of less than or equal to 4 and a tantalum nitride removal rate of at least eighty percent of copper removal rate at a pad pressure of 13.8 kPa.

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Changzhou Kejia Chemical Co. (Product Detail Poly (Maleic Acid), date unknown.
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Colloidal Dynamics; The CMP Slurry Monitor, 2000.

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