Chemical-mechanical planarization composition having...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S690000, C438S692000, C510S175000, C252S079100

Reexamination Certificate

active

07316977

ABSTRACT:
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a ketoxime compound and water. The composition may also contain an abrasive and/or a per compound oxidizing agent. The composition affords tunability of removal rates for metal, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).

REFERENCES:
patent: 5085694 (1992-02-01), Cifuentes
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 6117783 (2000-09-01), Small et al.
patent: 6193790 (2001-02-01), Tani
patent: 6313039 (2001-11-01), Small et al.
patent: 6454819 (2002-09-01), Yano et al.
patent: 6582761 (2003-06-01), Nishimoto et al.
patent: 6585825 (2003-07-01), Skee
patent: 6599370 (2003-07-01), Skee
patent: 6635186 (2003-10-01), Small et al.
patent: 6645051 (2003-11-01), Sugiyama et al.
patent: 6730157 (2004-05-01), Steinert et al.
patent: 6755721 (2004-06-01), Ward et al.
patent: 6777335 (2004-08-01), Hasegawa
patent: 6852632 (2005-02-01), Wang et al.
patent: 6866792 (2005-03-01), Small et al.
patent: 6869336 (2005-03-01), Hardikar
patent: 6918820 (2005-07-01), Smith et al.
patent: 2002/0111024 (2002-08-01), Small et al.
patent: 2003/0137052 (2003-07-01), Horiuchi et al.
patent: 2003/0162399 (2003-08-01), Singh
patent: 2003/0176068 (2003-09-01), Small et al.
patent: 2004/0021125 (2004-02-01), Taiji et al.
patent: 2004/0072439 (2004-04-01), Small et al.
patent: 2004/0118051 (2004-06-01), Shiho et al.
patent: 2004/0134873 (2004-07-01), Yao et al.
patent: 2004/0144755 (2004-07-01), Motonari et al.
patent: 2004/0175948 (2004-09-01), DeSimone et al.
patent: 2006/0046490 (2006-03-01), Banerjee et al.
patent: 1198534 (2004-10-01), None
patent: 2001-313275 (2001-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemical-mechanical planarization composition having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical-mechanical planarization composition having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-mechanical planarization composition having... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2757750

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.