Chemical-mechanical contouring (CMC) method for forming a contou

Details Chemical-mechanical contouring (CMC) method for forming a contou Chemical-mechanical contouring (CMC) method for forming a contou

1996-10-31

1999-08-24

Eisenschenk, Frank C.

Metal working

Method of mechanical manufacture

Electrical device making

2960301, 2960314, 2960315, 2960325, 2960319, G11B 5127, G11B 533

Patent

active

059409568

ABSTRACT:
A method of fabricating thin film magnetic heads on a thin film substrate uses a chemical-mechanical contouring (CMC) step after completion of the fundamental thin film head structure to form a curved surface on the substrate for the individual thin film magnetic heads of a substantial plurality of heads on a thin film substrate. A special CMC process utilizes a soft polishing pad, applying mechanical contouring motion at a slow speed, typically on the order of 1/3a typical conventional CMP rotational speed, and at a relatively high pressure, typically two to three times a typical conventional CMP applied pressure.

REFERENCES:
patent: 4921508 (1990-05-01), Nonaka
patent: 5302233 (1994-04-01), Kim et al.
patent: 5617273 (1997-04-01), Carr et al.
patent: 5684660 (1997-11-01), Gray et al.

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