Chemical leadframe roughening process and resulting...

Details Chemical leadframe roughening process and resulting... Chemical leadframe roughening process and resulting...

2006-07-18

2006-07-18

Lam, Cathy F. (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

With textured surface

C257S766000, C257S787000, C428S612000, C174S257000, C174S259000

Reexamination Certificate

active

07078809

ABSTRACT:
A chemical leadframe roughening process includes cleaning and chemically micro-etching a raw copper leadframe to remove organic material and oxide material from the surface. The surface of the leadframe is then roughened using an organic and peroxide solution, resulting in a finely pitted surface morphology. The roughened leadframe is cleaned to remove organic material, and then is plated with a lead-free plating material (such as a layered plating of nickel-palladium-gold (NiPdAu)) having a reflow temperature higher than the reflow temperature of lead-based solder. The plated leadframe exhibits the desired finely pitted morphology that is believed to provide for greater bonding with the mold compound used to make a finished integrated circuit package, thereby improving the moisture sensitivity level (MSL) performance of the package.

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