Chemical gas analysis during processing of chemically amplified

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

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430311, 430330, G03F 900

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active

059897635

ABSTRACT:
Gases evolved during photolithographic processing of chemically amplified photoresist systems are monitored to allow optimization of process parameters such as intensity and duration of applied heat or radiation. Specifically, during soft bake, evaporation of solvent gases is detected. During exposure and PEB, gases evolved during activation of the polymer resin component by the photoacid are detected. The intensity and/or duration of the heating or exposure are then varied to optimize resolution of the particular photolithography process. Residual gas analysis, diode laser spectroscopy, FT-IR spectroscopy, and electronic sensing may be utilized alone or in combination to monitor composition and/or concentration of evolved gases in accordance with the present invention.

REFERENCES:
patent: 5789124 (1998-08-01), Todd
Davidson, T., ACS Symposium Series 242 Polymers in Electronics, American Chemical Society, Washington, D.C. (1984).
Mack, C.A., "Inside PROLITH, A Comprehensive Guide to Optical Lithography Simulation", by FINLE Technologies, Inc., pp. 76-80.
"Commercial DUV Photoresist Systems", Clariant Photoresist Product Flyer (1 pg.).
"Negative DUV Photoresist Chemistry", Clariant Photoresist Product Flyer (1 pg.).
Mertesdorf, C., et al., "Structural Design of Ketal and Acetal Blocking Groups in 2-Component Chemically Amplified Positive DUV Resists", SPIE vol. 2438, pp. 84-98.

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