Chemical-enhanced package singulation process

Details Chemical-enhanced package singulation process Chemical-enhanced package singulation process

2004-05-11

2009-06-30

Prenty, Mark (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S691000

Reexamination Certificate

active

07553700

ABSTRACT:
Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package regions of the matrix exposes underlying metal to subsequent chemical etching steps. In an alternative embodiment, a separate photoresist mask may be patterned over the matrix to selectively expose metal in inter-package regions to chemical etching.

REFERENCES:
patent: 5172214 (1992-12-01), Casto
patent: 6143981 (2000-11-01), Glenn
patent: 6355502 (2002-03-01), Kang et al.
patent: 6420779 (2002-07-01), Sharma et al.
patent: 6437429 (2002-08-01), Su et al.
patent: 6476478 (2002-11-01), Swiss et al.
patent: 6583499 (2003-06-01), Huang et al.
patent: 6630728 (2003-10-01), Glenn
patent: 6812552 (2004-11-01), Islam et al.
patent: 6841414 (2005-01-01), Hu et al.
patent: 6951801 (2005-10-01), Pozder et al.
patent: 2004/0040856 (2004-03-01), Hamano
Duffek et al., “Etching in Printed Circuit Handbook”, Chapter 6 C.F. Coombs, Ed. (McGraw-Hill, New York, 1967).
Orbis Technologies, Ltd., Drilling & De-Smearing Flexible Printed Circuits, http://www.orbitech.col.uk/appst01.html, printed Aug. 17, 2004.
Sigma, Etching Process, http://www.sigma-mecer.com/chem..html, printed Aug. 17, 2004.

Affiliated with

Also associated with

Rating

Chemical-enhanced package singulation process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical-enhanced package singulation process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical-enhanced package singulation process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4145489