Chemical drying and cleaning method

Drying and gas or vapor contact with solids – Process – With contacting of material treated with solid or liquid agent

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34342, 34401, F26B 300

Patent

active

061193666

ABSTRACT:
Method and apparatus for drying and/or cleaning a workpiece, such as an electronic part, semiconductor wafer, printed circuit board or the like. As the workpiece is withdrawn from a processing liquid, a selected drying liquid, such as hydrofluoroether (HFE), ethylated HFE, an HFE azeotrope or an ethylated HFE azeotrope, that has a very small surface tension, is volatile, and has a density that is greater than the processing liquid density, is sprayed on, dribbled on or otherwise transferred to an exposed surface of the workpiece. The exposed surface may be stationary, may be rotating or may be moving along a selected path. The workpiece can be dried in 5-60 seconds, or less, in most situations and can be cleaned using the invention. Drying and/or cleaning can be performed in a single workpiece process, a single workpiece continuous process or a batch process.

REFERENCES:
patent: 5571337 (1996-11-01), Mohindra et al.
patent: 5685086 (1997-11-01), Ferrell
patent: 5685327 (1997-11-01), Mohindra et al.
patent: 5776296 (1998-07-01), Matthews

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chemical drying and cleaning method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chemical drying and cleaning method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical drying and cleaning method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1059845

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.