Chemical copper plating solution

Details Chemical copper plating solution Chemical copper plating solution

1979-04-18

1980-07-08

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, 427 98, C23C 302

Patent

active

042115647

ABSTRACT:
An aqueous plating solution consists essentially of a copper ion-releasing compound, a copper ion-complexing agent, a copper ion-reducing agent, a hydroxide of alkali metal, 2,2'-dipyridyl, polyethyleneglycolstearylamine, and silver sulfide has a good liquid stability and a high plating speed, and a chemical copper plating film obtained from the plating solution has a high toughness (tensile strength.times.elongation).

REFERENCES:
patent: 3515563 (1970-06-01), Hodoley et al.
patent: 3804638 (1974-04-01), Jonker et al.
patent: 3843373 (1974-10-01), Molenaar et al.
patent: 4002786 (1977-01-01), Hirohata et al.

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