Chemical copper-plating bath

Details Chemical copper-plating bath Chemical copper-plating bath

1980-12-04

1983-02-01

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, 4274431, C23C 302

Patent

active

043713971

ABSTRACT:
There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

REFERENCES:
patent: 3457089 (1969-07-01), Shipley et al.
patent: 3607317 (1971-09-01), Schneble
patent: 3661597 (1972-05-01), Gulla
patent: 3804638 (1974-04-01), Jonker et al.
patent: 4002786 (1977-01-01), Hirohata et al.

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