Chemical copper-blating bath

Details Chemical copper-blating bath Chemical copper-blating bath

1987-07-01

1988-12-13

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427 96, 427 98, B22F 700, B05D 512

Patent

active

047908769

ABSTRACT:
In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.

REFERENCES:
patent: 3246994 (1966-04-01), Ritchie
patent: 3516848 (1970-06-01), Foulke
patent: 4152477 (1979-05-01), Haruta et al.
patent: 4655833 (1987-04-01), Amelio
Abstract 60-149784 "Electroless Copper Plating Solution", Aug. 7, 1985.
Abstract 60-155683 "Electroless Copper Plating Solution", Aug. 15, 1985.

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