Chemical composition for dissolving a sample taken from...

Details Chemical composition for dissolving a sample taken from... Chemical composition for dissolving a sample taken from...

2006-09-19

2006-09-19

Snay, Jeffrey R. (Department: 1743)

Chemistry: analytical and immunological testing

Optical result

C436S175000, C436S179000

Reexamination Certificate

active

07109039

ABSTRACT:
A chemical for dissolving a sample taken from the semiconductor device fabrication equipment for analyzing the contaminants attached thereon, and a method of analyzing the contaminants thereby. The chemical composition is made of equal ports of sulfuric acid, hydrogen fluoride, and nitric acid. The method includes a) immersing a sample taken from semiconductor device fabrication equipment in the chemical composition; b) dissolving the sample in the chemical composition; c) cooling the dissolved sample; d) diluting the dissolved sample with deionized water and e) analyzing the diluted sample using either Atomic Absorption Spectrometer or by Atomic Emission Spectroscopy.

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Kunze, J. et al. “Determination of titanium and zirconium wear debris in blood serum by means of HNO3/HF pressurized digestion using ICP—optical emission spectroscopy” Fresenius' Journal of Analytical Chemistry, vol. 361 (Jul. 1988) abstract only.

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