Chelating metals

Details Chelating metals Chelating metals

1984-02-13

1986-05-06

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 54R, 106 122, C25D 356, C25D 360, C23C 3000

Patent

active

045869901

ABSTRACT:
A method for plating metallic leads or terminals of integrated circuits having a leaded glass component with a plating composition that avoids dentrite growth, can be soldered, and is corrosion resistant is disclosed. According to the method, the metallic element is electroplated with lead and tin simultaneously. An aqueous plating solution comprising water, sulphate ion, tin, and chelated lead, where the lead is chelated with either ethylene diamine or ethylene diamine gluconate, is formed. The metallic element with a leaded glass portion is placed in the solution and an electrical current is passed through this solution to deposit lead and tin on the metallic element to form a plating comprising at least about 90 percent by weight tin, and at least about 2 percent by weight lead. The plating solution and the plated substrate produced by the method of the present invention are also novel.

REFERENCES:
patent: 2751341 (1956-06-01), Smart
patent: 3120550 (1964-02-01), Langer
patent: 3152155 (1964-10-01), Langer
patent: 3249408 (1966-05-01), Marafioti
patent: 3625837 (1971-12-01), Nelson et al.
patent: 3875029 (1975-04-01), Rosenberg et al.
patent: 3956123 (1976-05-01), Rosenberg et al.
patent: 4135991 (1979-01-01), Canaris et al.
patent: 4139425 (1979-02-01), Eckles et al.
patent: 4263106 (1981-04-01), Kohl

Affiliated with

Also associated with

Rating

Chelating metals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chelating metals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chelating metals will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1572953