Chassis conducted cooling thermal dissipation apparatus for...

Details Chassis conducted cooling thermal dissipation apparatus for... Chassis conducted cooling thermal dissipation apparatus for...

2006-12-05

2006-12-05

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S704000, C361S707000, C257S715000, C174S015200, C174S016100, C174S016300, C165S080300, C165S080400, C165S104260

Reexamination Certificate

active

07145775

ABSTRACT:
A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

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