Charging protection device

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer

Reexamination Certificate

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C438S009000, C438S199000, C438S141000, C438S753000, C257SE21042, C257SE21051, C257SE21320, C257SE21311, C257SE21352, C257SE21370, C257SE21550, C257SE21546

Reexamination Certificate

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08048753

ABSTRACT:
Shallow trench isolation silicon-on-insulator (SOI) devices are formed with improved charge protection. Embodiments include an SOI film diode and a P+substrate junction as a charging protection device. Embodiments also include a conductive path from the SOI transistor drain, through a conductive contact, a metal line, a second conductive contact, an SOI diode, isolated from the transistor, a third conductive contact, a second conductive line, and a fourth conductive contact to a P+-doped substrate contact in the bulk silicon layer of the SOI substrate.

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International Search Report and Written Opinion for corresponding application PCT/US2010/037592, dated Aug. 13, 2010, pp. 1-13.

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