Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices
Patent
1998-03-25
1999-10-26
Berman, Jack I.
Radiant energy
Irradiation of objects or material
Irradiation of semiconductor devices
25049222, 250398, H01J 37317, H01J 37153
Patent
active
059733330
ABSTRACT:
Charged-particle-beam projection-microlithography apparatus and methods are disclosed for transferring a reticle pattern image to a substrate using a charged-particle beam. The apparatus comprises, along an optical axis in the trajectory direction of the charged-particle beam, a beam emitter for emitting the charged-particle beam toward the mask, a beam shaper for shaping the charged-particle beam so as to have a square or rectangular transverse profile and deflectors for directing the charged-particle beam onto the mask. If the beam shaper creates a charged-particle beam having a rectangular transverse profile, the deflectors of the pattern-transfer apparatus of the present invention operate so that the longer sides of the transverse profile of the charged-particle beam extend in a direction perpendicular to the scanning direction. An axisymmetric projection-lens system converges, inverts and reduces the charged-particle beam which has passed through the mask, to form an image of the mask pattern on a substrate.
REFERENCES:
patent: 5773837 (1998-06-01), Nakasuji
patent: 5773838 (1998-06-01), Nakasuji
Idesawa et al., "Discontinuity reduction method in pattern connection", J. Vac. Sci. Tech. 19(4), 983-987, Nov./Dec. 1981.
Nakasuji Mamoru
Okino Teruaki
Berman Jack I.
Nikon Corporation
LandOfFree
Charged-particle-beam pattern-transfer apparatus and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Charged-particle-beam pattern-transfer apparatus and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Charged-particle-beam pattern-transfer apparatus and methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-767471