Charged particle beam exposure method and apparatus

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

250398, H01J 37302

Patent

active

052763340

ABSTRACT:
A charged particle beam exposure method includes the steps of (a) selectively irradiating a charged particle beam on at least one selected opening forming a selected pattern of a mask which includes a plurality of openings related to a plurality of kinds of patterns so as to shape a cross section of the charged particle beam which is transmitted through the selected opening, where the area of the mask is divided into a plurality of blocks each including at least one opening which is related to one pattern, and (b) irradiating the charged particle beam which is transmitted through the selected opening of the mask onto an object surface so as to expose a desired pattern corresponding to at least a part of the pattern of the selected opening on the object surface, where the step (a) carries out first and second deflections independently of each other with respect to the charged particle beam. The first deflection deflects the charged particle beam within a first deflection range which corresponds to the size of one block and the second deflection deflects the charged particle beam within a second irradiating range which covers a plurality of blocks of the mask, so that the second deflection deflects the charged particle beam to irradiate the selected opening out of the plurality of openings of the mask and the first deflection sets the first deflection range of the charged particle beam with respect to the selected opening.

REFERENCES:
patent: 3749964 (1973-07-01), Hirata
patent: 4218621 (1980-08-01), Nakasuji et al.
patent: 4492870 (1985-01-01), de Chambost et al.
patent: 4560878 (1985-12-01), Knauer et al.
patent: 4692579 (1987-09-01), Saiton et al.
patent: 4818885 (1989-04-01), Davis et al.
patent: 4870286 (1989-09-01), Tobuse
patent: 4914304 (1990-04-01), Koyama
patent: 5124560 (1992-06-01), Fueki
patent: 5136167 (1992-08-01), Langner et al.
patent: 5148033 (1992-09-01), Yamada et al.
"Recent Advances in Electron-Beam Lithography for the High-Volume Production of VLSI Devices", Pfeiffer, IEEE Transactions on Electron Devices, vol. ED-26, No. 4, Apr., 1979, pp. 663-674.
"Electron Optics for High Throughout Electron Beam Lithography System", Sohda et al., J. Vac. Sci. Technol. B 9 (6), Nov./Dec. 1991, pp. 2940-2943.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Charged particle beam exposure method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Charged particle beam exposure method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Charged particle beam exposure method and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-309873

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.