Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1976-09-10
1977-11-01
Dost, Gerald A.
Metal working
Method of mechanical manufacture
Assembling or joining
357 24, B01J 1700, H01L 2958
Patent
active
040558851
ABSTRACT:
A charge transfer semiconductor device is made of a semiconductor body on one surface of which is formed an insulating layer of SiO.sub.2. A plurality of first series of electrodes of Al are disposed on the SiO.sub.2 layer and oxide regions (Al.sub.2 O.sub.3) of the first series of electrodes are disposed on side surfaces of the first series of electrodes, which are formed by oxidizing the side surfaces of the first series of electrodes. A plurality of second series of electrodes is provided, each of which is disposed between a pair of the first series of electrodes so as to be separated from the first series of electrodes by the oxide region. Finally, means are connected to the electrodes for forming spatially defined depletion regions in the surface of the semiconductor body beneath the electrodes and for transferring charges between the depletion regions.
REFERENCES:
patent: 3438121 (1969-04-01), Warlass et al.
Dost Gerald A.
Hitachi , Ltd.
LandOfFree
Charge transfer semiconductor device with electrodes separated b does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Charge transfer semiconductor device with electrodes separated b, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Charge transfer semiconductor device with electrodes separated b will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-892