Charge system for destroying chips on a circuit board and...

Explosive and thermic compositions or charges – Structure or arrangement of component or product – Contiguous layers or zones

Reexamination Certificate

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C149S002000, C149S015000, C149S037000, C149S108200, C149S109400

Reexamination Certificate

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07896988

ABSTRACT:
A charge system for destroying chips on a circuit board is provided. The charge system has a first substrate having a number of recesses formed therein with each of the recesses having a housing disposed therein. A high density charge is disposed within the housing. A number of recesses are formed within the high density charge. A number of low density charges are disposed within each of the recesses formed within the high density charge. A second substrate is located proximate to the first substrate. The low density charge and the high density charge are structured to destroy the second substrate after ignition. A method of destroying chips is also provided.

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patent: 4963203 (1990-10-01), Halcomb et al.
patent: 4996922 (1991-03-01), Halcomb et al.
patent: 5042386 (1991-08-01), Kruse et al.
patent: 6183569 (2001-02-01), Mohler
patent: 6805832 (2004-10-01), Mohler
patent: 2005/0215053 (2005-09-01), Soininen et al.
International Searching Authority (ISA/US), “Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration”, Sep. 17, 2008, 9 pp.

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