Charge skimming and variable integration time in focal plane arr

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

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257232, 257451, 257455, H01L 29796, H01L 2714, H01L 2956

Patent

active

053269969

ABSTRACT:
Methods and apparatus for implementing charge skimming and variable integration time in focal plane arrays formed in a silicon substrate. The present invention provides for pulsing a field plate that lies over a diode disposed in the substrate in order to provide for charge skimming and variable integration time. The field plate is normally dc biased to suppress diode edge leakage. No additional structure is needed in the silicon substrate, and basic readout clocking is unaffected. Any interline transfer focal plane array can benefit from using the principles of the present invention.

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