Charge plate fabrication process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 64, 156 83, 156196, 1563073, 1566301, 216 20, 347 76, 403 30, B32B 3100

Patent

active

055121179

ABSTRACT:
A charge plate fabrication process provides a charge plate assembly having minimal distortion caused by shifts in temperature and humidity. The fabrication process includes the steps of forming a charge plate coupon having a plurality of charging electrodes and electrical connections on an etchable substrate and providing a ceramic charge plate substrate. An adhesive layer is then applied between the charge plate coupon and the charge plate substrate before assembling the charge plate coupon and the charge plate substrate in a fixture. Finally, the assembly is cured in the fixture.

REFERENCES:
patent: 3790953 (1974-02-01), Sugiya
patent: 3975741 (1976-08-01), Solyst
patent: 4314866 (1982-02-01), Webber
patent: 4334232 (1982-06-01), Head
patent: 4560991 (1985-12-01), Schutrum

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