Heat exchange – Heating and cooling – Heating and cooling of the same material
Patent
1978-09-29
1981-07-21
Smith, Alfred E.
Heat exchange
Heating and cooling
Heating and cooling of the same material
165 80A, 357 82, F25B 2900, F28F 700, H01L 2504
Patent
active
042792924
ABSTRACT:
A temperature and moisture regulator for such devices as integrated circuits and the like is disclosed as comprising an insulated mount for the device whose temperature and moisture is to be regulated, a first thermoelectric cooler in effective contact with both a certain substantially central area of said device and one end of an elongated metal heat-sink. A plurality of resilient heat-conductive, thermal feedback fingers are metallurgically bonded at one of the ends thereof to said heat-sink and are urged against a portion of the surface areas of said device at the other ends thereof in predetermined spatial dispositions from but in proximity with the aforesaid central area thereof that is in contact with said first thermoelectric cooler. Hence, both cooled and heated areas occur on various surfaces of said device, the former of which effects the cooling thereof, and the latter of which effects the heating thereof and, thus, the controlling of whatever moisture is caused by the cooling thereof. A second thermoelectric cooler is effectively connected between the other end of said heat-sink and a heat exchanger.
REFERENCES:
patent: 2930904 (1960-03-01), Fritts
patent: 3406753 (1968-10-01), Habdas
patent: 3412566 (1968-11-01), Townsend et al.
patent: 3800190 (1974-03-01), Marek
patent: 4034469 (1977-07-01), Koopman et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4051509 (1977-09-01), Beriger et al.
patent: 4120019 (1978-10-01), Arii et al.
Kerjilian, Q. K. et al., "Heat-Pipe Cooled Stacked Electronic Wafer Packa IBM Technical Disclosure Bullentin, vol. 18, No. 12 May 1976, 3982-3983.
Adams Robert W.
Howell Janice A.
Sciascia Richard S.
Smith Alfred E.
The United States of America as represented by the Secretary of
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