Charge coupled device package

Details Charge coupled device package Charge coupled device package

2006-05-09

2006-05-09

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S113000, C438S667000, C257S431000, C257S432000, C257S433000, C257S434000

Reexamination Certificate

active

07041527

ABSTRACT:
An image sensor chip is mounted on a printed wiring frame over a substrate, which is plated with a spider web of plated conductors connecting the chip through plated through conduit which wraps around the edge of the substrate to form pads at the bottom of the substrate as output terminals for connection to a printed circuit board. After wiring bonding the chip to the plated conductor, the package is sealed. The structure is amenable to mass production. A large number of printed wiring frames are arranged as a matrix on a common substrate The frames are sealed column by column or sealed all at once. After sealing, the common substrate are diced into individual packages. The image sensor package may mounted with integrated circuit chips as peripheral circuits. The image sensor chips may be sealed with transparent glue and the integrated circuit chip may be sealed with opaque glue.

REFERENCES:
patent: 5729437 (1998-03-01), Hashimoto
patent: 5882949 (1999-03-01), Okazaki
patent: 6383835 (2002-05-01), Hata et al.

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