Charge coupled circuit arrangement using a punch-through charge

Electrical transmission or interconnection systems – Nonlinear reactor systems – Parametrons

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357 16, 357 30, 357 61, 357 63, 307221D, 250338, 250370, H01L 2978, H01L 2714, H01L 3100

Patent

active

042583764

ABSTRACT:
A charge coupled circuit arrangement uses a punch-through charge introduction effect to convert electromagnetic radiation into electrical signals. The invention is particularly, but not exclusively, adapted to convert electromagnetic radiation in the infra-red wavelength band into electrical signals. A charge coupled device using the punch-through charge introduction effect is also disclosed.

REFERENCES:
patent: 3792465 (1974-02-01), Collins et al.
patent: 3852801 (1974-12-01), Itoh et al.
patent: 3864722 (1975-02-01), Carnes
patent: 3896485 (1975-07-01), Early
patent: 3973136 (1976-08-01), Lee
patent: 4142198 (1979-02-01), Finnila et al.
Barbe "Solid State Infrared Imaging", NATO Advanced Study Institute, Louvain-La-Neuve, Belgium (9/75), Published in Jespers et al., Eds., Solid State Imaging, Noordhoff, Leyden, Netherlands (1976), pp. 673-687.

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