Characterizing in-situ deformation of hard pellicle during...

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system

Reexamination Certificate

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Reexamination Certificate

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06834549

ABSTRACT:

BACKGROUND
Photolithography systems have been using soft polymer-based pellicles to protect masks/reticles from particle and contamination. The current pellicle mounting technique (pellicle-to-reticle and pellicle-to-frame) is a combined mechanical and chemical adhesion process. Large compression, i.e., a high stress level, is applied to the adjoining reticle and pellicle system with adhesive applied in the gap between them. In order to achieve a hermetical seal and reliable bonding, pressure as high as 27,000 kg/m
2
has been commonly applied.


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