Characteristics evaluation method of intermediate layer circuit

Details Characteristics evaluation method of intermediate layer circuit Characteristics evaluation method of intermediate layer circuit

2005-03-01

2005-03-01

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C219S121690, C219S121830, C228S103000, C228S104000, C451S005000, C451S041000

Reexamination Certificate

active

06859990

ABSTRACT:
The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with a laser to ablate material to a predetermined thickness; polishing the upper layer substrate ablated to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.

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Inoue, Akira et al., “High-Efficiency 0.1cc Power Amplifier Module for 900 MHz Personal Digital Cellular Telephones”, IEICE Transactions on Electronics, vol. E82-C, No. 11, Nov. 1999.

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