Heat exchange – Heat transmitter
Patent
1998-03-23
2000-05-30
Leo, Leonard
Heat exchange
Heat transmitter
165 803, 174 163, 257722, 361704, 361720, H05K 720
Patent
active
060680512
ABSTRACT:
The heat sink includes a mounting block having a channel for clamping a device being coupled to the heat sink. The channel serves as a clamp to substantially eliminate relative rotation between the heat sink and the device when the device is being fastened to the heat sink. The heat sink further includes a first wall and a second wall wherein the first and second walls and the mounting block provide a substantially U-shaped body for the heat sink. In one embodiment, the heat sink includes a threaded nut aligned with a hole in the channel to ease alignment issues when the device is being fastened to the heat sink. In one embodiment, the heat sink includes convection fins extending from a U-shaped base and a U-shaped top of the heat sink. In one embodiment, the heat sink includes mounting pins inserted into the base of the heat sink. In one embodiment, the heat sink includes anti-tipping pins inserted into the base of the heat sink. The mounting pins and the anti-tipping pins have a knurled portion in one embodiment. Additional fillet between convection fins provides the anti-tipping pins with a gripping surface when they are inserted into the base. Additional fillet formed at the junction of the first and second wall and the mounting block provides the mounting pins with a gripping surface when they are inserted into the base. The U-shaped body is capable of being manufactured through extrusion.
REFERENCES:
patent: 3217793 (1965-11-01), Coe
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4204248 (1980-05-01), Proffit et al.
patent: 4215361 (1980-07-01), McCarthy
patent: 4261005 (1981-04-01), McCarthy
patent: 4509839 (1985-04-01), Lavochkin
patent: 4544942 (1985-10-01), McCarthy
patent: 4558209 (1985-12-01), Hess
patent: 4602315 (1986-07-01), Breese
patent: 4625260 (1986-11-01), Jordan et al.
patent: 4662695 (1987-05-01), Ohkawara et al.
patent: 4691765 (1987-09-01), Wozniczka
patent: 4847449 (1989-07-01), Jordan et al.
patent: 4933746 (1990-06-01), King
patent: 5372186 (1994-12-01), Taki et al.
Intel Corporation
Leo Leonard
LandOfFree
Channeled heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Channeled heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Channeled heat sink will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1903827