Channel stop isolation technology utilizing two-step etching and

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29576B, 29578, 29580, 148 15, 148DIG85, 148DIG117, 156643, 357 50, H01L 2131, H01L 2176

Patent

active

045383430

ABSTRACT:
A sidewall-nitride isolation technology avoids stress-induced defects, while permitting a heavy channel stop implant to avoid turn-on of the field oxide transistor, by performing a two-step silicon etch. The first channel stop implant is performed after the first silicon etch, before the sidewall nitride is deposited. A further silicon etch is performed after the sidewall nitride is in place, and a second channel stop implant follows. The first implant can be a light dose, to avoid excess subthreshold leakage in the active devices due to field-assisted turn on at the corners of the moat regions, and the second implant can be a very heavy dose to provide complete isolation without any danger of the channel stop species encroaching on the active device regions.

REFERENCES:
patent: 3958040 (1976-05-01), Webb
patent: 3966514 (1976-06-01), Feng et al.
patent: 4219369 (1980-08-01), Ogiue et al.
patent: 4271583 (1981-06-01), Kahng et al.
patent: 4292156 (1981-09-01), Matsumoto et al.
patent: 4361600 (1982-11-01), Brown
patent: 4445967 (1984-05-01), Kameyama

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Channel stop isolation technology utilizing two-step etching and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Channel stop isolation technology utilizing two-step etching and, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Channel stop isolation technology utilizing two-step etching and will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-606757

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.