Chamfering the notch of a semiconductor wafer

Details Chamfering the notch of a semiconductor wafer Chamfering the notch of a semiconductor wafer

1989-09-27

1991-01-15

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51 98R, B24B 4900

Patent

active

049843923

ABSTRACT:
A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning device for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor device for conveying the wafer to a chamfering position; a holding device for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving device for driving the abrasive wheel; and a mechanism for controlling moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.

REFERENCES:
patent: 342789 (1886-06-01), Fenton
patent: 1133515 (1915-03-01), Uhlemann
patent: 1196294 (1916-08-01), Sanderson
patent: 1282022 (1918-10-01), Baker et al.
patent: 2971408 (1961-02-01), Robinson
patent: 4800686 (1989-01-01), Hirabayashi

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