Chamfer device for cutting packaging materials

Cutting – Means to drive or to guide tool – Constantly urged tool or tool support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C083S639100, C083S667000, C083S681000, C083S682000

Reexamination Certificate

active

07047858

ABSTRACT:
A chamfer cutting device for cuffing packaging materials comprises a die and a knife part which has a plurality of knives. The die can be moved toward the knife part in order to carry out a cut. The knives are arranged individually in the knife part in a force-dependent manner in such a way that their position with respect to the tool plate varies in a defined way as a function of the force produced by contact with the packaging material or the die. In the event of contact between the knife and the die, a force acts on the knife which does not exceed a predefined maximum force. The chamfer cutting device has the advantage that the die can be guided right up to the knives.

REFERENCES:
patent: 2663180 (1953-12-01), Benedict
patent: 4250784 (1981-02-01), Bredow
patent: 4273738 (1981-06-01), Spengler
patent: 4329897 (1982-05-01), Scribner
patent: 4631996 (1986-12-01), Magnuson
patent: 4730761 (1988-03-01), Spano
patent: 4833884 (1989-05-01), Seko et al.
patent: 4905558 (1990-03-01), Corcoran
patent: 4938105 (1990-07-01), Böswarth
patent: 4951537 (1990-08-01), Bennett
patent: 4993295 (1991-02-01), Dacey, Jr.
patent: 5671589 (1997-09-01), Irvine et al.
patent: 5797189 (1998-08-01), Gilbert
patent: 5964134 (1999-10-01), Arends
patent: 6000311 (1999-12-01), Katoh et al.
patent: 6106453 (2000-08-01), Sinn et al.
patent: 6314852 (2001-11-01), Long et al.
patent: 2004/0173072 (2004-09-01), Ishii et al.
patent: 447 461 (1967-11-01), None
patent: 43 11 092 (1994-12-01), None
patent: 195 21 604 (1997-04-01), None
patent: 615 910 (1994-09-01), None
patent: 655 303 (1995-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chamfer device for cutting packaging materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chamfer device for cutting packaging materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chamfer device for cutting packaging materials will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3573887

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.