Chamber having a protective layer

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Reexamination Certificate

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C347S050000, C347S065000

Reexamination Certificate

active

06942318

ABSTRACT:
A chamber includes a substrate, a chamber layer disposed on the substrate that defines the sidewalls of the chamber, and the chamber layer has a chamber surface. The chamber has an area in the plane formed by the chamber surface in the range from about 1 square micrometer to about 10,000 square micrometers. The chamber also includes an orifice layer disposed over the chamber layer. The orifice layer has a first and second orifice surface and a bore wherein the bore has an area in the plane formed by the first orifice surface less than the chamber area. The chamber further includes a protective layer deposited, through the bore, on the sidewalls of the chamber layer and a portion of the first orifice surface.

REFERENCES:
patent: 4643948 (1987-02-01), Diaz et al.
patent: 5119116 (1992-06-01), Yu
patent: 5985759 (1999-11-01), Kim et al.
patent: 6121134 (2000-09-01), Burton et al.
patent: 6316360 (2001-11-01), Burton et al.
patent: 6380625 (2002-04-01), Pramanick et al.
patent: 6390609 (2002-05-01), Shigemura et al.
patent: 6641254 (2003-11-01), Boucher et al.
patent: 6737109 (2004-05-01), Stanton et al.
patent: 2002/0047152 (2002-04-01), Yamamoto et al.
patent: 09216359 (1997-08-01), None
‘Plasma-enhanced atomic layer deposition of Ta andTi for interconnect diffusion barriers’ by S.M. Rossnagel IBM Research Yorktown Heights, N.Y.from 2000 American Vacuum Society (J. Vac. Sci Technol. B 18(4), Jul.Aug. 2000 pp. 2016-2020.
‘Metal ion deposition from ionized mangetron sputtering discharge’ by S.M. Rossnagel IBM Research Yorktown Heights, N.Y. from 1994 American Vacuum Society (J. Vac. Sci. Technol. B12(1), Jan./Feb. 1994 pp. 449-453.
‘Simulations of trench-filling profiles under ionized magnetron sputter metal deposition’ by S. Hamaguchi and S.M. Rossnagel, IBMThomas J. Watson Research Center, Yorktown Heights, N.Y. 10598 from American Vacuum Society (J. Vac. Sci. Technol. B 13(2) Mar./Apr. 1995 pp. 183-191.
‘Liner confromality in ionized magetron sputter metal deposition processes’ by S. Hamaguchia) and S.M. Rossnagel b) , IBMThomas J. Watson Research Center, Yorktown Heights, New York 10598 from 1996 American Vacuum Society (J. Vac Sci. Technol. B 14(4) Jul./Aug. 1996 pp. 2603-2608.
‘Ionized Magnetron Sputtering for Lining and Filling Trenches and Vias’ by S.M. Rossnagel IBM Research Yorktown Heights, N.Y. from “Semiconductor International” Feb. 1996 pp. 99-102.

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