Chain link metal interconnect structure

Details Chain link metal interconnect structure Chain link metal interconnect structure

2011-01-11

2011-01-11

Barton, Jeffrey T (Department: 1795)

Batteries: thermoelectric and photoelectric

Photoelectric

Cells

C136S259000, C136S244000, C136S251000

Reexamination Certificate

active

07868248

ABSTRACT:
An interconnect structure is provided by applying a conductive layer (typically one or more metal layers23,28) over the entire surface of the module (11) to form all of the contacts (19,32) to all of the cells in the module and then scribing the conductive layer into a series of strips using a series of straight high speed laser scribes. The strips are then divided into individual links by scribing transversely to the first scribe direction with the laser turned on and off to cut each alternate stripe. The p-type regions of the cells are contacted through holes (19), n-type regions are contacted through holes (32). A silicon film (12) is separated into cells (35a,b,c,d) by isolation grooves (16). In a first embodiment, every second transverse scribe is offset by one strip such that each strip is cut into links which overlap two links on either side that are offset by a distance equal to half the pitch of the links. The pitch of the links is equal to two cell widths and the transverse scribes are coincident with or close to interruptions in the underlying cell layout representing cell boundaries between adjacent cells of the module. In a second embodiment, conductive bridges extend across longitudinal interruptions separating the parallel extending strips. In this embodiment, the like type contact pads for the cells are aligned in rows extending transverse to the cell boundary with alternating rows of p type and n type contact pads.

REFERENCES:
patent: 4981525 (1991-01-01), Kiyama et al.
patent: 5421908 (1995-06-01), Yoshida et al.
patent: 2024662 (1991-03-01), None
patent: 2-307278 (1990-12-01), None
patent: 6-342924 (1994-12-01), None
patent: 7-050427 (1995-02-01), None
patent: 7-297436 (1995-11-01), None
patent: 2-647892 (1997-05-01), None
patent: 10-233517 (1998-09-01), None
patent: 2001-156305 (2001-06-01), None
patent: WO 83/03925 (1983-11-01), None
patent: WO 97/21253 (1997-06-01), None
patent: WO 01/33639 (2001-05-01), None
patent: WO 02/05352 (2002-01-01), None
Japanese Office Action mailed Nov. 18, 2008 for JP Application No. 2003-523019, six pages, (English translation and Japanese language document.).
Supplementary European Search Report mailed on May 11, 2009, for EP Application No. 02759882.0, three pages.

Affiliated with

Also associated with

Rating

Chain link metal interconnect structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chain link metal interconnect structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chain link metal interconnect structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2723578