Cermet substrate with spinel adhesion component

Details Cermet substrate with spinel adhesion component Cermet substrate with spinel adhesion component

1986-03-12

1988-05-10

Terapane, John F.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75244, 174 52R, C22C 2912, H02G 1308

Patent

active

047432993

ABSTRACT:
The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

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"A Method for Fabrication of Aluminum-Alumina Composites", by B. F. Quigley et al., American Society for Metals and the Metallurgical Society of AIME, Metallurgical Transactions A, vol. 13A, Jan. 1982.

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