Cermet substrate with spinel adhesion component

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Metal and nonmetal in final product

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75234, 75235, 75244, 264DIG36, 419 13, 419 23, 419 28, 419 48, B22F 100

Patent

active

047939672

ABSTRACT:
The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

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"A Method for Fabrication of Aluminum-Alumina Composites" by B. F. Quigley et al., American Society for Metals and the Metallurgical Society of AIME, Metallurgical Transactions A, vol. 13A, Jan. 1982.

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