Abrasive tool making process – material – or composition – With inorganic material – Metal or metal oxide
Reexamination Certificate
2005-03-08
2005-03-08
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With inorganic material
Metal or metal oxide
C051S307000, C106S003000, C423S263000, C438S692000, C438S693000
Reexamination Certificate
active
06863700
ABSTRACT:
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
REFERENCES:
patent: 5011671 (1991-04-01), Le Loarer
patent: 5260249 (1993-11-01), Shiraishi et al.
patent: 5389352 (1995-02-01), Wang
patent: 5543126 (1996-08-01), Ota et al.
patent: 5697992 (1997-12-01), Ueda et al.
patent: 5766279 (1998-06-01), Ueda et al.
patent: 5876490 (1999-03-01), Ronay
patent: 6120571 (2000-09-01), Aihara et al.
patent: 6221118 (2001-04-01), Yoshida et al.
patent: 0 820 092 (1998-01-01), None
patent: 875547 (1998-11-01), None
patent: 2 583 034 (1986-12-01), None
patent: S53-006756 (1978-03-01), None
patent: 03-115383 (1991-05-01), None
patent: 03-287686 (1991-12-01), None
patent: H7-502778 (1993-11-01), None
patent: H6-73327 (1994-03-01), None
patent: H6-263515 (1994-06-01), None
patent: 06-216096 (1994-08-01), None
patent: H06-216096 (1994-08-01), None
patent: H06-330025 (1994-11-01), None
patent: H6-330025 (1994-11-01), None
patent: 06-330025 (1994-11-01), None
patent: 07-502778 (1995-03-01), None
patent: H7-116431 (1995-05-01), None
patent: H7-172933 (1995-07-01), None
patent: 07-309668 (1995-11-01), None
patent: H8-3540 (1996-01-01), None
patent: H8-3541 (1996-01-01), None
patent: H8-22970 (1996-01-01), None
patent: 08-003541 (1996-01-01), None
patent: H08-022970 (1996-01-01), None
patent: H8-81218 (1996-03-01), None
patent: 8-81218 (1996-03-01), None
patent: 08-081218 (1996-03-01), None
patent: H8-134435 (1996-05-01), None
patent: 08-134435 (1996-05-01), None
patent: H08-153696 (1996-06-01), None
patent: H8-153696 (1996-06-01), None
patent: 08-153696 (1996-06-01), None
patent: H8-257898 (1996-10-01), None
patent: 08-257898 (1996-10-01), None
patent: H10-102038 (1998-04-01), None
patent: H10-106994 (1998-04-01), None
patent: H11-012561 (1999-01-01), None
patent: 96-006924 (1992-11-01), None
patent: WO 9322103 (1993-11-01), None
Office Action dated Jan. 28, 2003 for corresponding Korean Patent Application No. 10-2002-7006123 with English translation.
Homma, Yoshio et al, “Selective CMP of Organic Sog for Low Parasitic Capacitance Quarter-Micron Multilevel Interconnections”, Feb. 22-23, 1996, Chemical-Mechanical Polish for VLSI/ULSI Multilievel Interconnection Conference, pps. 67-71.
Notification of Reasons for Refusal for Japanese Patent Application No. 1997-014371 dated Sep. 3, 2002.
Notification of Reasons for Refusal for Japanese Patent Application No. 1996-258769 dated Feb. 10, 2004.
Notification of Reasons for Refusal for Japanese Patent Application No. 1997-112396 dated Feb. 10, 2004.
Office Action issused by the Korean Patent Office, dated May 17, 2004.
Office Action issused by Japanese Patent Office in corresponding JP Application No. H09-112396, drafted May 10, 2004, mailed May 18, 2004.
Manufactory Operation Series, Enlarged Edition, Fine Pulverization Techniques and Pulverizer, Kagaku Kogyosha Co., Ltd. 1991, including English-language translation. (no month).
Catalog of Shimadzu Centrifugal Sedmentation Type Particle Distribution Measurement Apparatus (no date).
Actuality of Powder X-ray Analysis (Introduction of Rietveld Method) Edited by the Japan Society for Analytical Chemsitry X-Ray Analysis Investigation Conversazione (Authors: Izumi Nakai and Fujio Izumi) (no date).
English translation of Office Action issued by Japanese Patent Office dated May 18, 2004.
Ashizawa Toranosuke
Kurata Yasushi
Matsuzawa Jun
Ootuki Yuuto
Tanno Kiyohito
Griffin & Szipl, P.C.
Hitachi Chemical Company Ltd.
Marcheschi Michael
LandOfFree
Cerium oxide abrasive and method of polishing substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cerium oxide abrasive and method of polishing substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cerium oxide abrasive and method of polishing substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3415404