Cerium oxide abrasive and method of polishing substrates

Details Cerium oxide abrasive and method of polishing substrates Cerium oxide abrasive and method of polishing substrates

2011-01-11

2011-01-11

Green, Anthony J (Department: 1793)

Abrasive tool making process, material, or composition

With inorganic material

Metal or metal oxide

C051S298000, C051S307000, C106S003000, C451S041000, C423S629000, C423S629000

Reexamination Certificate

active

07867303

ABSTRACT:
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.

REFERENCES:
patent: 4462188 (1984-07-01), Payne
patent: 4475981 (1984-10-01), Rea
patent: 4588421 (1986-05-01), Payne
patent: 4954142 (1990-09-01), Carr et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5011671 (1991-04-01), Le Loarer
patent: 5260249 (1993-11-01), Shiraishi et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5389352 (1995-02-01), Wang
patent: 5525559 (1996-06-01), Metcalfe et al.
patent: 5543126 (1996-08-01), Ota et al.
patent: 5697992 (1997-12-01), Ueda et al.
patent: 5766279 (1998-06-01), Ueda et al.
patent: 5858813 (1999-01-01), Scherber et al.
patent: 5876490 (1999-03-01), Ronay
patent: 6120571 (2000-09-01), Aihara et al.
patent: 6221118 (2001-04-01), Yoshida et al.
patent: 6419557 (2002-07-01), Nojo et al.
patent: 6863700 (2005-03-01), Yoshida et al.
patent: 7192461 (2007-03-01), Morii et al.
patent: 0820092 (1998-01-01), None
patent: 0875547 (1998-11-01), None
patent: 2583034 (1986-12-01), None
patent: 53006756 (1978-03-01), None
patent: 60-108489 (1985-06-01), None
patent: 02-097424 (1990-04-01), None
patent: 03115383 (1991-05-01), None
patent: 03287696 (1991-12-01), None
patent: 04-202069 (1992-07-01), None
patent: 05-004868 (1993-01-01), None
patent: 07502778 (1993-11-01), None
patent: 5-326469 (1993-12-01), None
patent: 0673327 (1994-03-01), None
patent: 06216096 (1994-08-01), None
patent: 06263515 (1994-09-01), None
patent: 06330025 (1994-11-01), None
patent: 07-070553 (1995-03-01), None
patent: 07116431 (1995-05-01), None
patent: 07172933 (1995-07-01), None
patent: 07309668 (1995-11-01), None
patent: 083540 (1996-01-01), None
patent: 083541 (1996-01-01), None
patent: 08022970 (1996-01-01), None
patent: 0881218 (1996-03-01), None
patent: 08-134435 (1996-05-01), None
patent: 08134435 (1996-05-01), None
patent: 08153696 (1996-06-01), None
patent: 08-197414 (1996-08-01), None
patent: 08257898 (1996-10-01), None
patent: 2 592 401 (1996-12-01), None
patent: 08-333157 (1996-12-01), None
patent: 2592401 (1996-12-01), None
patent: 09-048672 (1997-02-01), None
patent: 9-270402 (1997-10-01), None
patent: 10102038 (1998-04-01), None
patent: 10106994 (1998-04-01), None
patent: 10-152673 (1998-06-01), None
patent: 11012561 (1999-01-01), None
patent: 96006924 (1992-11-01), None
patent: 93/22103 (1993-11-01), None
patent: 93/22103 (1993-11-01), None
patent: 9322103 (1993-11-01), None
European Office Action, issued Sep. 24, 2004 .
Homma, Yoshio et al. “Selective CMP of Organic Sog for Low Parasitic Capacitance Quarter-Micron Multilevel Interconnections”, Chemical-Mechanical Polish for VLSI/ULSI Multilevel Interconnection Conference, Feb. 22-23, 1996, pp. 67-71.
Notification for Reasons for Refusal for Japanese Patent Application No. 1997-014371 dated Sep. 3, 2002.
Notification for Reasons for Refusal for Japanese Patent Application No. 1996-258768 dated Feb. 10, 2004.
Notification for Reasons for Refusal for Japanese Patent Application No. 1997-112396 dated Feb. 10, 2004.
Office Action issued by the Korean Patent Office, dated May 17, 2004.
Office Action issued by the Japanese Patent Office in corresponding Japanese Application No. 09-112396, dated May 10, 2004 and mailed May 18, 2004.
Manufactory Operation Series, Enlarged Edition, Fine Pulverization Techniques and Pulverizer, Kagaku Kogyosha Co., Ltd., 1991, with English language translation.
Catalog of Shimadzu Centrifugal Sedimentation Type Particle Distribution Measuring Apparatus.
Nakai, Isumi et al., “Actuality of Powder X-ray Analysis (Introduction of Rietveld Method)” edited by the Japan Society for analytical Chemistry of X-Ray Analysis Investigation Conversazione.
Office Action issued in corresponding Korean Patent Application No. 10-2002-7006123 dated Jan. 28, 2003, with English translation.
English translation of Office Action issued by Japanese Patent Office dated May 18, 2004.
Office Action issued in parent U.S. Appl. No. 10/960,941 dated Jun. 5, 2006.
Office Action issued in corresponding U.S. Appl. No. 11/276,157 dated Jul. 6, 2006.
Judgement issued Jun. 20, 2006 in corresponding Japanese application No. 10611,2005, Request for cancellation of Trial Decision, with full English translation.
Japanese Office Action issued Jun. 22, 2006 in corresponding Japanese application.
Japanese Office Action issued Jul. 11, 2006 in corresponding Japanese application.
Japanese Office Action issued Sep. 12, 2006 in corresponding Japanese application.
English translation of Japanese Office Action issued Jun. 22, 2006 in corresponding Japanese application (previously cited in IDS on Nov. 3, 2006).
English translation of Japanese Office Action issued Jul. 11, 2006 in corresponding Japanese application (previously cited in IDS on Nov. 3, 2006).
English translation of Japanese Office Action issued Sep. 12, 2006 in corresponding Japanese application (previously cited in IDS on Nov. 3, 2006).
Honma, Torajiro et al., “Effect of Various Factors on Grinding Using Jet Mill,” Kagaku Kogyo Ronbunshu, vol. 6, No. 5, 1980, pp. 527-532.
Notification of Refusal issued in the corresponding Japanese application on Oct. 9, 2007.
English translation of the Document of Printed Publication dated on Dec. 27, 2004 in the counterpart Japanese Application No. H09-207866.
Office Action issued in corresponding Japanese application No. 2001-103923, issued Sep. 24, 2008.
Office Action issued in corresponding Japanese application No. 2001-275530, issued Sep. 24, 2008.
Trial Decision issued on Mar. 31, 2009 in the counterpart Japanese application with English translation.
Office Action issued Apr. 1, 2009 in copending U.S. Appl. No. 11/276,157 and copending U.S. Appl. No. 10/960,941.
Office Action issued May 12, 2009 in the corresponding Japanese Application No. 2006-246039 with English translation attached.
Office Action issued May 12, 2009 in the corresponding Japanese Application No. 2006-246046.
Office Action issued May 19, 2009 in the corresponding Japanese Application No. 2006-335090 with English translation attached.
International Search Report, issued in corresponding EP Application No. 09 178 160.9, completed Feb. 4, 2010, mailed Feb. 11, 2010.
Office Action issued in corresponding Japanese Application No. 2007-323889, mailed Jun. 8, 2010, in Japanese text.
English translation of Office Action in corresponding Japanese Application No. 2007-323889, mailed Jun. 8, 2010.

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