Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-22
2005-03-22
Zarneke, David (Department: 2829)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Reexamination Certificate
active
06869823
ABSTRACT:
Disclosed is a cerdip type of solid-state image sensing device having a simple construction, capable of directly gripping and performing a positioning adjustment of a high accuracy. The cerdip type of solid-state image sensing device comprises a base on which photoelectric transfer devices are arranged in line along a main scanning direction, a sealed glass disposed on said base for fixing a lead frame, a wind frame disposed on said sealed glass, a transparent cover glass disposed on said wind frame, and gripped surface means for gripping said cerdip type of solid-state image sensing device.
REFERENCES:
patent: 6531341 (2003-03-01), Peterson et al.
U.S. Appl. No. 10/461,422, filed Jun. 16, 2003, Morii et al.
U.S. Appl. No. 10/379,532, filed Mar. 6, 2003, Morii et al.
Geyer Scott B.
Ricoh & Company, Ltd.
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