Ceramic wiring substrate blank material and process for producti

Details Ceramic wiring substrate blank material and process for producti Ceramic wiring substrate blank material and process for producti

1988-03-04

1990-12-11

Lesmes, George F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428698, 428901, 427 96, 156 89, B32B 1508, B32B 1516, B32B 1904

Patent

active

049770128

ABSTRACT:
A blank material for use as a ceramic wiring substrate of this invention is prepared by laminating a copper foil onto a ceramic base formed from a boron nitride sintered body or the like via a bonding layer interposed therebetween, and incoporating an inorganic filler in at least the ceramic base-containing side of the bonding layer.
A fine and high density circuit substrate can be easily formed from the ceramic wiring substrate blank material according to the present invention by a conventional etching method.

REFERENCES:
patent: 4492730 (1985-01-01), Oishi et al.
patent: 4781968 (1988-11-01), Kellerman

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