Ceramic wiring substrate and process for producing the same

Details Ceramic wiring substrate and process for producing the same Ceramic wiring substrate and process for producing the same

1987-01-27

1988-03-29

Wyse, Tom

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 65, 427 96, 4271262, 4273762, 428209, 428210, 428901, 501 69, C04B 3332, H05K 312

Patent

active

047342331

ABSTRACT:
A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.

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