Ceramic wiring boards and method for their manufacture

Details Ceramic wiring boards and method for their manufacture Ceramic wiring boards and method for their manufacture

1997-05-02

1999-08-03

Speer, Timothy M.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428472, 428701, 428702, 264 61, B32B 300

Patent

active

059323264

ABSTRACT:
A ceramic wiring board having a metalized part. The metalized part contains 100 parts by weight of an electrical-conduction imparting material made of at least one metal selected from the group consisting of Ag, Pd, Au and Pt; 3 to 5 parts by weight of a W and/or Mo compound, calculated in terms of metal W and/or metal Mo; and 1 to 10 parts by weight of a glass composition. The W compound includes WO.sub.3 and/or WSi.sub.2, while the Mo compound includes MoSi.sub.2. In the ceramic wiring board, the shrinkage behavior on sintering of the wiring material can be made similar to that of the ceramic material, so that warping and deformation of the wiring board are minimized.

REFERENCES:
patent: 4927505 (1990-05-01), Sharma

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