Ceramic wiring board and method of producing the same

Details Ceramic wiring board and method of producing the same Ceramic wiring board and method of producing the same

1997-08-12

2000-03-21

Krynski, Wiliam

Stock material or miscellaneous articles

Composite

Of inorganic material

428627, 428620, 428612, 428552, 428570, 428209, 428163, B32B 900

Patent

active

060400684

ABSTRACT:
A ceramic wiring board has a non-oxide based ceramic substrate which is a sintered body containing aluminum nitride, silicon nitride or the like as main component, and a metallized layer formed on the non-oxide based ceramic substrate; the metallized layer is plasma-etched, irregularities having a difference of elevation of about 0.5 to about 200 nm are formed on the surface of metal particles forming the metallized layer which are positioned on the surface of the metallized surface, and a metal plated layer is further formed on the metallized layer.

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W.F. Marx et al., "Plasma and processing effects of electrode spacing for tungsten etchback using a bipolar electrostatic wafer clamp", J. Vac. Sci. Technol. A 12(6), Nov./Dec. 1994, pp. 3087-3090.

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