Ceramic wiring board and its production

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

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Details

29851, 29852, H05K 100

Patent

active

047926465

ABSTRACT:
A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.
Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

REFERENCES:
patent: 4313026 (1982-01-01), Yamada et al.
patent: 4641425 (1987-02-01), Dubuisson et al.
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4681656 (1987-07-01), Byrum
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4715117 (1987-12-01), Enomoto
Humenik, J. N. et al; Multilayer Ceramic Substrates Containing Mullite; IBM Technical Disclosure Bulletin; vol. 20, No. 11B; Apr. 1978; p. 4787.
McDermott, C. J.; Face Protection of Printed Circuit Boards; IBM Technical Disclosure Bulletin; vol. 11, No. 7; Dec. 1968; p. 733.

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