Ceramic wiring board and its production

Details Ceramic wiring board and its production Ceramic wiring board and its production

1986-03-14

1987-12-29

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29852, H01K 322, H01K 310

Patent

active

047151170

ABSTRACT:
A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.
Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

Affiliated with

Also associated with

Rating

Ceramic wiring board and its production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic wiring board and its production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic wiring board and its production will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-454712