Ceramic-to-conducting-lead hermetic seal

Details Ceramic-to-conducting-lead hermetic seal Ceramic-to-conducting-lead hermetic seal

1993-03-29

1993-12-28

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228198, 228255, 174152GM, H01J 932, H01J 940

Patent

active

052732037

ABSTRACT:
A hermetic seal is provided for a conductive feedthrough through a thin ceramic component by a platinum or palladium lead by sealing the gap between the lead and the ceramic with a copper-copper oxide eutectic. The lead may have a copper coating on it prior to and subsequent to formation of the copper-copper oxide eutectic.

REFERENCES:
patent: 3336433 (1967-08-01), Johnson et al.
patent: 3419762 (1968-12-01), Lucas
patent: 3744120 (1973-07-01), Burgess et al.
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3854892 (1974-12-01), Burgess et al.
patent: 3901772 (1975-08-01), Guillotin et al.
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3929426 (1975-12-01), Blust et al.
patent: 3950142 (1976-04-01), Brenan et al.
patent: 3970235 (1976-07-01), Blust et al.
patent: 3993411 (1976-11-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4217137 (1980-08-01), Kraska et al.
patent: 4409278 (1983-10-01), Johym
patent: 4560826 (1985-12-01), Burns et al.
patent: 4563383 (1986-01-01), Kuneman et al.
patent: 4610756 (1986-09-01), Strobel

Affiliated with

Also associated with

Rating

Ceramic-to-conducting-lead hermetic seal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic-to-conducting-lead hermetic seal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic-to-conducting-lead hermetic seal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1537312