Ceramic susceptor for semiconductor manufacturing equipment

Details Ceramic susceptor for semiconductor manufacturing equipment Ceramic susceptor for semiconductor manufacturing equipment

2003-10-24

2009-02-17

Speer, Timothy M (Department: 1794)

Stock material or miscellaneous articles

Hollow or container type article

Glass, ceramic, or sintered, fused, fired, or calcined metal...

C428S469000, C428S701000, C428S702000

Reexamination Certificate

active

07491432

ABSTRACT:
For semiconductor manufacturing equipment, a ceramic susceptor that without occurrence of cracking in the course of heating wafers suppresses thermal radiation from the circumferential surface of a wafer placed on the ceramic susceptor, to heighten isothermal quality in the wafer face. A semiconductor-manufacturing-equipment ceramic susceptor (1) including a resistive heating element (3) in the face or interior of ceramic substrates (2a,2b) has a wafer pocket (5) consisting of a recess that can accommodatingly carry a wafer. The angle that the perimetric inside surface and the bottom face of the wafer pocket (5) form is over 90° and 170° or less, and/or the curvature of the bottom-portion circumferential rim where the perimetric inside surface and the bottom face of the pocket join is 0.1 mm or more. A plasma electrode furthermore may be disposed in the face or interior of the ceramic substrates (2a,2b) of the ceramic susceptor (1).

REFERENCES:
patent: 5231690 (1993-07-01), Soma et al.
patent: H06-28258 (1992-04-01), None
patent: H07-230876 (1995-08-01), None
patent: 2000-114354 (2000-04-01), None
patent: 2000-290773 (2000-10-01), None
patent: 2000-290773 (2000-10-01), None
patent: 2002-134484 (2002-05-01), None
Machine translation of JP 2002-134484, cited on applicant's IDS.

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