Ceramic substrates for microelectronic circuits and process for

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428138, 428209, 428426, 428432, 428457, 428901, 174256, 361397, 361414, 501119, 501128, B32B 300

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049352857

ABSTRACT:
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystralline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.

REFERENCES:
patent: 4272500 (1981-06-01), Eggerding et al.
patent: 4736276 (1988-04-01), Ushifusa et al.
patent: 4817276 (1989-04-01), Toda et al.
Amer. Cer. Soc. Bull., May 1984, Preparation and Properties of Mullite Cordierite Composites, Mussler et al., pp. 705-710.

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