Ceramic substrate with integrated circuit bonded thereon

Details Ceramic substrate with integrated circuit bonded thereon Ceramic substrate with integrated circuit bonded thereon

1982-10-21

1984-07-17

Dixon, Jr., William R.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

428446, 428699, 428701, 428702, H01L 2700

Patent

active

044609167

ABSTRACT:
A ceramic substrate, suitable for use as a circuit substrate on which integrated circuit chips are bonded, which consists essentially of, based on the weight of the substrate, 0.5.about.5.0% by weight of MgO, and 95.0.about.99.5% by weight of the total of Al.sub.2 O.sub.3 and SiO.sub.2, the proportion of the Al.sub.2 O.sub.3 to the SiO.sub.2 being in the range from 50:50 to 80:20 by weight.

REFERENCES:
patent: 2864919 (1958-12-01), Stringfellow
patent: 3923530 (1975-12-01), Sherk et al.
patent: 4272500 (1981-06-01), Eggerding et al.

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