Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-12-09
1996-01-16
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174260, 174250, 361767, 361768, 361760, H05K 111
Patent
active
054849632
ABSTRACT:
A ceramic substrate is provided at a planar side surface thereof with a group of metallized layers which constitute terminals for connection with a mounting article such as an integrated circuit chip. The metallized layers each have an elongated shape such as an oblong or oval shape and are elongated in radial direction extending from a point which is located on the planar side surface of the ceramic substrate and which is substantially at the center of the group of the metallized layers.
REFERENCES:
patent: 5291375 (1994-03-01), Mukai
patent: 5315485 (1994-05-01), Magill et al.
patent: 5381307 (1995-01-01), Hertz et al.
Clark et al., "IBM Multichip Multilayer Ceramic Modules For LSI Chips-Design For Performance And Density", IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. CHMT-3:89-93, (1980).
A. J. Blodgett, Jr., "A Multilayer Ceramic Multichip Module", IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. CHMT-3:634-637, (1980).
L. F. Miller, "Controlled Collapse Reflow Chip Joining", IBM J. Res. Develop., vol. 13:225-340, (1969).
NGK Spark Plug Co. Ltd.
Thomas Laura
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