Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-03-01
2011-03-01
Dinh, Tuan T (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C174S262000, C361S816000, C361S818000, C361S790000, C361S785000
Reexamination Certificate
active
07897879
ABSTRACT:
Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of power plane and ground plane conductive grids that are laid out in rhomboid patterns. The power plane and ground plane grids possess a left-right mirror relation to one another and are displaced to place the rhomboid's corners to avoid overlapping any of the grid lines.
REFERENCES:
patent: 4038040 (1977-07-01), Nagl
patent: 4700016 (1987-10-01), Hitchcock et al.
patent: 5675299 (1997-10-01), Suski
patent: 5812380 (1998-09-01), Frech et al.
patent: 5831836 (1998-11-01), Long et al.
patent: 6150895 (2000-11-01), Steigerwald et al.
patent: 6373719 (2002-04-01), Behling et al.
patent: 6483714 (2002-11-01), Kabumoto et al.
patent: 6657130 (2003-12-01), Van Dyke et al.
patent: 6750732 (2004-06-01), Ikami
patent: 6900395 (2005-05-01), Jozwiak et al.
patent: 7348667 (2008-03-01), Chun et al.
patent: 2001/0010271 (2001-08-01), Lin et al.
patent: 2006/0022310 (2006-02-01), Egitto et al.
Office Action for U.S. Appl. No. 11/610,082 dated Aug. 15, 2007.
Office Action for U.S. Appl. No. 11/610,082 dated Feb. 7, 2008.
Office Action for U.S. Appl. No. 12/269,082 dated Jun. 8, 2010.
Becker Wiren D.
Chen Zhaoqing
Katopis George
Aychillhum Andargie M
Dinh Tuan T
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Jung, Esq. Dennis
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